Special Report
Micro-LED Display Technologies for XR Applications
₩0
January 22, 2025
Introduction
Micro-LED display is gaining attention as a next-generation display after OLED display. Surely before commercialization, there are several improvements required on manufacturing processes, production costs, full-color implementation, and yield management.
UBI Research’s newly published report, “Micro-LED Display Technologies for XR Applications,” visualizes the viable core technologies for the production of XR Micro-LED displays in detail. In the report, the various manufacturing processes for Micro-LED displays are fully covered, in systematical way, from substrate bonding methods to mono-color and full-color display production technologies, and Quantum Dot (QD)-based color conversion technologies. In other words, full compilation of production technologies for XR LEDoS displays.
Through this report, the engineers can understand current Micro-LED technologies. The case studies of the research organization/institutions, possessing or pursuing innovation, can be referred to commercialization of the technologies. It serves as a crucial resource for designing the commercialization strategies and future technological advancements of Micro-LED displays for XR at the end.
Contents
1.1 Fabrication methods of micro-LED display
1.2 Substrate bonding approaches in micro-LED display fabrication
2. Mono-color Micro-LED Display using Hybrid Bonding Methods
2.1 Basic fabrication process for mono-color micro-LED chip array
2.2 Fabrication method for mono-color micro-LED display using die-to-die hybrid bonding
2.3 Fabrication method for mono-color micro-LED display using die-to-wafer hybrid bonding
2.4 Fabrication method for mono-color micro-LED display using wafer-to-wafer hybrid bonding
3. Mono-color Micro-LED Display using Full Wafer Bonding Methods
3.1 Basic fabrication process for full wafer bonding
3.2 Development case of the mono-color micro-LED display using full wafer bonding
4. Full-color Micro-LED Display using Multiple Stacking and Bonding Methods
4.1 Full-color display using multiple adhesive bonding method
4.2 Full-color display using 2D materials-based layer transfer method
4.3 Full-color display with vertical stacking method using multiple metallic bonding
5. Full-color Micro-LED Display using Monolithic Integration Methods
5.1 Monolithic full-color display using multi-layer epitaxial method
5.2 RGB monolithic GaInN-based micro-LED arrays connected via tunnel junctions
5.3 Eu-doped GaN and InGaN-based RGB monolithically stacked full-color micro-LEDs
5.4 Monolithic RGB micro-LED display using QD color conversion method
Report Sample
Previous Report Status
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